XIAOMI 18 FOLD TO FEATURE HOMEGROWN CHIPS

INDUSTRY DESK■ 1 MIN READ

SAT, AUG 29, 2026

■ AI-SUMMARIZED FROM 1 SOURCE ▸ TIMELINE

Xiaomi's upcoming flagship foldable will debut CXMT's LPDDR6 DRAM chips and Xiaomi's 3nm Xring O3 processor. The device launches in September.

Xiaomi and China's leading memory chipmaker CXMT announced the partnership on Saturday. The Xiaomi 18 Fold will be the first device to integrate CXMT's latest LPDDR6 DRAM memory chips, marking a significant step in domestic semiconductor adoption. The phone also features Xiaomi's in-house Xring O3 SoC, manufactured on a 3nm process. This combination represents Xiaomi's push toward vertical integration and reduced reliance on foreign chip suppliers. The September launch positions the 18 Fold as a showcase for Chinese chip technology. CXMT, listed on Shanghai's stock exchange, has been expanding its memory chip portfolio to compete with international manufacturers. The partnership underscores broader industry trends as Chinese companies develop homegrown alternatives to established chipmakers. Specifications for the foldable display and other features remain undisclosed.

■ SOURCES

► Techmeme

■ SUMMARY WRITTEN BY AI FROM THE LINKS ABOVE

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XIAOMI 18 FOLD TO FEATURE HOMEGROWN CHIPS

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