SK Hynix held a groundbreaking ceremony for a $4 billion advanced memory packaging facility in Indiana. Mass production of next-generation HBM chips is scheduled to begin in the second half of 2029.
The South Korean chipmaker's investment marks a significant expansion of US semiconductor manufacturing capacity. The facility will focus on high-bandwidth memory (HBM) production, a critical component for AI and data center applications.
SK Hynix joins other major chip manufacturers in expanding domestic production as countries prioritize semiconductor supply chain resilience. The Indiana location positions the company to serve North American markets and benefit from US incentives for chip manufacturing.
HBM technology has become essential for powering advanced AI systems and GPUs. Multiple chipmakers are racing to increase HBM production capacity to meet growing demand from data centers and AI infrastructure providers.
The facility represents SK Hynix's largest US investment to date. The company previously announced HBM production plans at its Icheon headquarters in South Korea, making this Indiana facility a key part of its global capacity expansion strategy heading into the next decade.
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